Work-in-Progress - First Revision gerbers being tested.
Pluggable SFP (SFF INF-8074i) and SFP+ (SFF-8432) Module Breakout for developing SFP modules. PCB must be manufactured with a 1.0mm thickness.
Similar Projects: SFP-Breakout-Board, SFP_BreakoutBoard, SFP-Loopback-Board, and Sfp-breakout(osmocom.org).
Differential pair parameters were calculated based on a board thickness of 1.0mm.
The 0.1" Header is designed to accept jumpers for the TX_FAULT, RX_LOSS, TX_DISABLE, and optionally Rate-Select signals. TX_FAULT, RX_LOSS, and TX_DISABLE jumpers need to be mounted for normal operation.
I have been testing with general purpose capacitors for the RX and TX DC-Blocking capacitors (C1, C2, C3, C4) but at <10Gbps bitrates. Capacitors will need to be sized smaller, 0402 or even 0201, and more effort would need to go into their selection for high bitrates. Look for capacitors designed for high-frequency.
Designator(s) | Part Number | Quantity | Value | Footprint | Availability |
---|---|---|---|---|---|
C1, C2, C3, C4 | GRM1885C1H103JA01D | 4 | 0.01uF | Capacitor_SMD:C_0603_1608Metric | DigiKey |
R1, R2, R3 | RMCF0603ZT0R00 | 3 | 0-Ohm | Resistor_SMD:R_0603_1608Metric | DigiKey |
R10, R11, R12 | RNCF0603DTE10K0 | 3 | 10k-Ohm | Resistor_SMD:R_0603_1608Metric | DigiKey |
J6 | PH2-12-UA | 1 | N/A | Conn_02x06 | DigiKey |
J2, J3, J4, J5 | CONUFL001-SMD-T | 4 | N/A | U.FL_w_Label:U.FL_Hirose_w_Label | DigiKey |
None | QPC02SXGN-RC | 4 | N/A | 1x2 0.1" Jumper | DigiKey |
U.FL-to-U.FL | 2015698-2 | 2 | N/A | None - Optional Part for Testing | DigiKey |