From 79934278571d39c9f5445cc7fb000ce9e7070303 Mon Sep 17 00:00:00 2001
From: Chris Morgan <chmorgan@gmail.com>
Date: Thu, 24 Sep 2020 09:23:22 -0400
Subject: [PATCH] csp.yaml - Update X1-WLB0909 footprint based on review
 feedback

---
 scripts/Packages/Package_BGA/csp.yaml | 10 +++++-----
 1 file changed, 5 insertions(+), 5 deletions(-)

diff --git a/scripts/Packages/Package_BGA/csp.yaml b/scripts/Packages/Package_BGA/csp.yaml
index f1ffd66df..ec6c6f586 100644
--- a/scripts/Packages/Package_BGA/csp.yaml
+++ b/scripts/Packages/Package_BGA/csp.yaml
@@ -474,12 +474,12 @@ WLCSP-8_1.551x2.284mm_P0.5mm:
   pad_diameter: 0.2
   layout_x: 2
   layout_y: 4
-WLCSP-4-X1-WLB0909-4_0.890x0.890_P0.500mm:
+WLCSP-4-X1-WLB0909-4_0.89x0.89mm_P0.5mm:
   description: "X1-WLB0909"
   size_source: 'https://www.diodes.com/assets/Datasheets/AP22913.pdf'
-  body_size_x: 0.890
-  body_size_y: 0.890
-  pitch: 0.500
-  pad_diameter: 0.235
+  body_size_x: 0.89
+  body_size_y: 0.89
+  pitch: 0.5
+  pad_diameter: 0.235 # even though ball_diameter is 0.235 analog recommends a landing pad of 0.235
   layout_x: 2
   layout_y: 2