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After slice, take stack at different intensity at specific xyz #36

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davidackerman opened this issue May 22, 2017 · 4 comments
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@davidackerman
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There will be a separate reference on the stage at a specific xyz position that will be imaged and used for calibration. So the process will be: after slice and before explore or surface find, move to specific xyz and take a stack at a separate laser intensity. This will be a setting in the .microscope file that will allow the user to choose v_open (percentage) for this specific task. This will be used to change one of the pockels.

@davidackerman
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Add ability to toggle it on and off. Also add ability to have array of targets.

@davidackerman
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Put the images in a separate folder in the same folder containing all the dates. Also make sure that movement to and from the calibration stack is done in a safe way, ie, move the stage down first, then move to image and vice versa.

@davidackerman
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By default, should be off

@davidackerman
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Make sure this has the inc(false) so that don't run into same date issue as occurs during autotile.

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