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tute1.kicad_pcb
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tute1.kicad_pcb
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(kicad_pcb (version 3) (host pcbnew "(2013-07-07 BZR 4022)-stable")
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(area 11.08178 16.93885 64.999998 49.900001)
(thickness 1.6)
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(page A4)
(title_block
(title Tute1)
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(0 B.Cu signal hide)
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(17 F.Adhes user hide)
(18 B.Paste user hide)
(19 F.Paste user hide)
(20 B.SilkS user hide)
(21 F.SilkS user)
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(23 F.Mask user hide)
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(28 Edge.Cuts user)
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(at (xyz 0 0 0.001))
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(rotate (xyz 0 0 0))
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(module SM0603 (layer F.Cu) (tedit 53F2F1E9) (tstamp 53C3B0C7)
(at 30.988 30.48)
(path /53BDFF85)
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(model smd\resistors\R0603.wrl
(at (xyz 0 0 0.001))
(scale (xyz 0.5 0.5 0.5))
(rotate (xyz 0 0 0))
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)
(module SM0603 (layer F.Cu) (tedit 53F2F1F2) (tstamp 53C3B0D1)
(at 27.94 30.48 180)
(path /53C3A29E)
(attr smd)
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(pad 1 smd rect (at -0.762 0 180) (size 0.635 1.143)
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(model smd\resistors\R0603.wrl
(at (xyz 0 0 0.001))
(scale (xyz 0.5 0.5 0.5))
(rotate (xyz 0 0 0))
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)
(module SM0603 (layer F.Cu) (tedit 53F2F1C8) (tstamp 53C3B0DB)
(at 27.432 43.688)
(path /53C3AA7A)
(attr smd)
(fp_text reference R2 (at -1.832 -0.238) (layer F.SilkS)
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(fp_line (start -1.143 0.635) (end -1.143 -0.635) (layer F.SilkS) (width 0.127))
(pad 1 smd rect (at -0.762 0) (size 0.635 1.143)
(layers F.Cu F.Paste F.Mask)
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(pad 2 smd rect (at 0.762 0) (size 0.635 1.143)
(layers F.Cu F.Paste F.Mask)
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(model smd\resistors\R0603.wrl
(at (xyz 0 0 0.001))
(scale (xyz 0.5 0.5 0.5))
(rotate (xyz 0 0 0))
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)
(module SM0603 (layer F.Cu) (tedit 53F2F1CB) (tstamp 53C3B0E5)
(at 30.48 42.164)
(path /53C3AA80)
(attr smd)
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(layers F.Cu F.Paste F.Mask)
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(pad 2 smd rect (at 0.762 0) (size 0.635 1.143)
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(model smd\resistors\R0603.wrl
(at (xyz 0 0 0.001))
(scale (xyz 0.5 0.5 0.5))
(rotate (xyz 0 0 0))
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)
(module SM0603 (layer F.Cu) (tedit 53F2F1C5) (tstamp 53C3B0EF)
(at 27.432 42.164 180)
(path /53C3AA86)
(attr smd)
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(layers F.Cu F.Paste F.Mask)
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(model smd\resistors\R0603.wrl
(at (xyz 0 0 0.001))
(scale (xyz 0.5 0.5 0.5))
(rotate (xyz 0 0 0))
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)
(module SM0603 (layer F.Cu) (tedit 53F2F226) (tstamp 53C3B0F9)
(at 30.48 40.64)
(path /53C3AA94)
(attr smd)
(fp_text reference R10 (at -0.005 -1.015) (layer F.SilkS)
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(layers F.Cu F.Paste F.Mask)
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(pad 2 smd rect (at 0.762 0) (size 0.635 1.143)
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(model smd\resistors\R0603.wrl
(at (xyz 0 0 0.001))
(scale (xyz 0.5 0.5 0.5))
(rotate (xyz 0 0 0))
)
)
(module SM0603 (layer F.Cu) (tedit 53F2F1C3) (tstamp 53C3B103)
(at 27.432 40.64 180)
(path /53C3AAA8)
(attr smd)
(fp_text reference R8 (at 1.932 0.29 180) (layer F.SilkS)
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(model smd\resistors\R0603.wrl
(at (xyz 0 0 0.001))
(scale (xyz 0.5 0.5 0.5))
(rotate (xyz 0 0 0))
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(module MyCon_2 (layer F.Cu) (tedit 53F2FD88) (tstamp 53C3B10D)
(at 35.75 31.15)
(path /53C39AD1)
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(fp_line (start -2.54 1.27) (end -2.54 -1.27) (layer F.SilkS) (width 0.15))
(pad 1 thru_hole rect (at -1.27 0) (size 1.5 1.5) (drill 1)
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(module u_CONN4 (layer F.Cu) (tedit 53F2F1DD) (tstamp 53CA15A2)
(at 48 25 270)
(path /53C798B7)
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(module SM0603_Capa (layer F.Cu) (tedit 53F2F218) (tstamp 53C3B3B1)
(at 33.02 38.1 90)
(path /53C3B517)
(attr smd)
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(net 2 +5V)
)
(pad 2 smd rect (at 0.762 0 90) (size 0.635 1.143)
(layers F.Cu F.Paste F.Mask)
(net 3 AGND)
)
(model smd\capacitors\C0603.wrl
(at (xyz 0 0 0.001))
(scale (xyz 0.5 0.5 0.5))
(rotate (xyz 0 0 0))
)
)
(module Pin4*1_V (layer F.Cu) (tedit 53F2F1DA) (tstamp 53C3B059)
(at 48 38 90)
(path /53C798B1)
(fp_text reference P6 (at -0.05 2.43 90) (layer F.SilkS)
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(net 3 AGND)
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)
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(module SM0603_Capa (layer F.Cu) (tedit 53F2F235) (tstamp 53C79A38)
(at 36.2 19.8 270)
(path /53C76F62)
(attr smd)
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(pad 1 smd rect (at -0.762 0 270) (size 0.635 1.143)
(layers F.Cu F.Paste F.Mask)
(net 3 AGND)
)
(pad 2 smd rect (at 0.762 0 270) (size 0.635 1.143)
(layers F.Cu F.Paste F.Mask)
(net 2 +5V)
)
(model smd\capacitors\C0603.wrl
(at (xyz 0 0 0.001))
(scale (xyz 0.5 0.5 0.5))
(rotate (xyz 0 0 0))
)
)
(module SM0603 (layer F.Cu) (tedit 53F2F231) (tstamp 53C79A42)
(at 33.8 18.4)
(path /53C749EB)
(attr smd)
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(at 30.8 18.4)
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(scale (xyz 0.5 0.5 0.5))
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)
)
(module L5.2*5.2 (layer F.Cu) (tedit 53F2F22C) (tstamp 53C79A69)
(at 35.56 25.908 180)
(path /53C74B60)
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(fp_text value 10uH (at 0.144 -0.25 180) (layer F.SilkS) hide
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(layers F.Cu F.Paste F.Mask)
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)
(pad 2 smd rect (at 1.524 0 180) (size 1.84 4.54)
(layers F.Cu F.Paste F.Mask)
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)
(module "DO-214AC(SMA)" (layer F.Cu) (tedit 53F2F1FE) (tstamp 53C79A81)
(at 28.8 24.6 180)
(descr "DO-214AC (SMA) PACKAGE.")
(tags "DO-214AC SMA")
(path /53C75850)
(attr smd)
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(pad 1 smd rect (at -1.89992 0 180) (size 1.6002 2.19964)
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(net 14 N-000006)
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(pad 2 smd rect (at 1.89992 0 180) (size 1.6002 2.19964)
(layers F.Cu F.Paste F.Mask)
(net 1 +24V)
)
(model smd/do214.wrl
(at (xyz 0 0 0))
(scale (xyz 0.95 0.95 0.95))
(rotate (xyz 0 0 0))
)
)
(module bornier2_3.5 (layer F.Cu) (tedit 53F2F1C0) (tstamp 53C3B118)
(at 20.828 31.496 90)
(descr "Bornier d'alimentation 2 pins")
(tags DEV)
(path /53BDF514)
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(fp_line (start -3.556 3.556) (end -3.556 2.286) (layer F.SilkS) (width 0.15))
(fp_line (start 3.556 -3.556) (end 3.556 3.556) (layer F.SilkS) (width 0.15))
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(net 8 N-0000014)
)
(model device/bornier_2.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module bornier2_3.5 (layer F.Cu) (tedit 53F2F1BE) (tstamp 53C3B123)
(at 20.828 39.116 90)
(descr "Bornier d'alimentation 2 pins")
(tags DEV)
(path /53C3AA8C)
(fp_text reference P3 (at -0.034 2.572 90) (layer F.SilkS)
(effects (font (size 1.524 1.524) (thickness 0.3048)))
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(fp_line (start -3.556 3.556) (end -3.556 2.286) (layer F.SilkS) (width 0.15))
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(fp_line (start -3.556 -3.556) (end -3.556 2.286) (layer F.SilkS) (width 0.15))
(pad 1 thru_hole rect (at -1.778 0 90) (size 2.04 2.04) (drill 1.324)
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(net 7 N-0000013)
)
(model device/bornier_2.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module bornier2_3.5 (layer F.Cu) (tedit 53F2F19F) (tstamp 53C3B12E)
(at 20.828 23.876 90)
(descr "Bornier d'alimentation 2 pins")
(tags DEV)
(path /53C3B369)
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(effects (font (size 1.524 1.524) (thickness 0.3048)))
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(fp_line (start -3.556 3.556) (end -3.556 2.286) (layer F.SilkS) (width 0.15))
(fp_line (start 3.556 -3.556) (end 3.556 3.556) (layer F.SilkS) (width 0.15))
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(net 3 AGND)
)
(model device/bornier_2.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module 1pin (layer F.Cu) (tedit 53C9E91D) (tstamp 53C7DD09)
(at 42.5 23.5)
(descr "module 1 pin (ou trou mecanique de percage)")
(tags DEV)
(path 1pin)
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(effects (font (size 1.016 1.016) (thickness 0.254)))
)
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(pad 1 thru_hole circle (at 0 0) (size 4.164 4.164) (drill 4.048)
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(net 3 AGND)
)
)
(module 1pin (layer F.Cu) (tedit 53C9E927) (tstamp 53C7ED07)
(at 42.5 39.5)
(descr "module 1 pin (ou trou mecanique de percage)")
(tags DEV)
(path 1pin)
(fp_text reference "" (at 0 -3.048) (layer F.SilkS)
(effects (font (size 1.016 1.016) (thickness 0.254)))
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(pad 1 thru_hole circle (at 0 0) (size 4.164 4.164) (drill 4.048)
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(net 3 AGND)
)
)
(module pad (layer F.Cu) (tedit 53D1B2A8) (tstamp 53CA14C6)
(at 32.2 21)
(fp_text reference "" (at 0 1.524) (layer F.SilkS)
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