Improve electrolytic cap placement and packages

[tanaes]

Version Number

rev12-mobo

Bugfix or Enhancement

bugfix and enhancement

Description

The existing placement of C12 (100 µF) potentially interferes slightly with the printed part:

This could create pressure on the capacitor solder joint, especially given some variance in the actual part diameter and positioning during reflow.

Additionally, part availability for electrolytic caps in the 6.3mm footprint at the required voltage and capacitance is very limited. Upgrading to an 8mm footprint allows a much broader part selection from higher-quality manufacturers.

Suggested Solution

1. update C16 to an 8mm footprint
2. nudge footprint position for C12
3. add some clearances to the printed parts for the repositioned solder joints

In my attempt this produces the following PCB layout (printed part outline in orange for reference):

and leaves plenty of room for the larger capacitor in the assembly:

[tanaes]

Looks like C16 sizing is also addressed by this PR: #1