- Course: ECE-GY 9423
- Instructor: Hamed Rahmani
- Institution: New York University
- Term: Fall 2024
- Electronic Files Submission: Cadence Library due by November 7, 2024, 11:59 PM EST
- Reports Due: December 8, 2024, before 5 PM
- Project Presentations: December 9, 2024, 11:00 AM - 1:30 PM EST
This project focuses on designing a transimpedance amplifier (TIA) for an optical receiver front-end. The design integrates a photoconductive diode to convert current signals from photodetectors into measurable voltage signals, crucial for applications in optical communications.
- Design a CMOS-based TIA emphasizing low noise performance, high gain, and bandwidth.
- Achieve a flat gain over a wide bandwidth to ensure efficient signal processing at high speeds.
- Integrating chiplet technology for enhanced performance and scalability.
- Utilizing Co-Packaged Optics (CPO) to improve data transfer rates while reducing power consumption.
- Image 1: Shows the concept of chiplet-based system architectures. (Refer to
chiplet_architecture.png) - Image 2: Illustrates the integration of optical and electrical domains within CPO. (Refer to
CPO_integration.png) - Image 3: Illustrated test bench to get circuit performance. (Refer to
Test_bench_.png)
- Input: Single-ended photo-diode with 0.5pF shunt capacitor.
- Outputs: Differential, connected to two 50-ohm loads.
- Supply Voltage: 1.2V
- Power Budget: Less than 50mW
- Transimpedance Gain: Greater than 74 dB
- Bandwidth: Exceeding 5GHz
- Differential Output Swing: Over 100mV
- Optional: Input-referred noise less than 50pA/sqrt(Hz).
- Conduct simulations to verify design against specifications.
- Include analytical predictions and simulated results, address any discrepancies.
- Provide a comprehensive report detailing all aspects of the design and simulation results.
- Prepare for a presentation outlining the project scope, methodology, results, and key learnings.