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thermal: intel: powerclamp: Fix cur_state for multi package system
commit 8e47363 upstream. The powerclamp cooling device cur_state shows actual idle observed by package C-state idle counters. But the implementation is not sufficient for multi package or multi die system. The cur_state value is incorrect. On these systems, these counters must be read from each package/die and somehow aggregate them. But there is no good method for aggregation. It was not a problem when explicit CPU model addition was required to enable intel powerclamp. In this way certain CPU models could have been avoided. But with the removal of CPU model check with the availability of Package C-state counters, the driver is loaded on most of the recent systems. For multi package/die systems, just show the actual target idle state, the system is trying to achieve. In powerclamp this is the user set state minus one. Also there is no use of starting a worker thread for polling package C-state counters and applying any compensation for multiple package or multiple die systems. Fixes: b721ca0 ("thermal/powerclamp: remove cpu whitelist") Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Cc: 4.14+ <stable@vger.kernel.org> # 4.14+ Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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